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portada Advances in 3D Integrated Circuits and Systems
Type
Physical Book
Author
Publisher
Language
English
Pages
392
Format
Hardcover
Dimensions
22.6x15.2x2.3 cm
Weight
0.57 kg.
ISBN13
9789814699006
Categories

Advances in 3D Integrated Circuits and Systems

Hao Yu (Author) · Chuan Seng Tan (Author) · World Scientific Publishing Company · Hardcover

Advances in 3D Integrated Circuits and Systems - Yu, Hao ; Tan, Chuan Seng

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Synopsis "Advances in 3D Integrated Circuits and Systems"

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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