Name: Electronic Materials Innovations and Reliability in Advanced Memory Packaging
SKU: 64791460
Price: 5284.00 TWD
Availability: InStock
Author: Chen Yu Huang;Chong Leong Gan
ISBN: 9783031947940

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portada Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Type

Physical Book

Publisher

Springer International Publishing AG

Author

Chen Yu Huang;Chong Leong Gan

Collection

Springer Series in Reliability Engineering

Year

2025

Pages

178

Format

Hardcover

Dimensions

23.5x15.5 cm

ISBN13

9783031947940

Electronic Materials Innovations and Reliability in Advanced Memory Packaging

Chen Yu Huang;Chong Leong Gan (Author) · Springer International Publishing AG · Hardcover

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Synopsis "Electronic Materials Innovations and Reliability in Advanced Memory Packaging"

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.