Name: Semiconductor Wafer Bonding: Science and Technology
SKU: 19372281
Price: 7127.00 TWD
Availability: InStock
Author: Tong, Q. -Y ; Gösele, U.
ISBN: 9780471574811

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portada Semiconductor Wafer Bonding: Science and Technology

Semiconductor Wafer Bonding: Science and Technology

Type

Physical Book

Author

Q. -Y Tong

U. Gösele

Publisher

Wiley-Interscience

Year

1998

Language

English

Pages

320

Format

Hardcover

Dimensions

24.4x15.2x2 cm

Weight

0.57 kg.

ISBN

0471574813

ISBN13

9780471574811

Synopsis "Semiconductor Wafer Bonding: Science and Technology "

Bonding - eine Technik zum "Verschwei en" von Halbleiter-Wafers ohne "Klebstoff" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur Wärmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01/99)

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Semiconductor Wafer Bonding: Science and Technology - Tong, Q. -Y ; Gösele, U.

Synopsis "Semiconductor Wafer Bonding: Science and Technology "

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