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  3. 1 Mathematics and sciences

Mathematics and sciences Books

We found 4 Books for lau john

Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

Lau, John
Springer, Paperback, New

NT$ 5,051
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.
Springer, Hardcover, New

NT$ 5,833
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

John H. Lau
Springer, 2018, 1 edition, Hardcover, New

NT$ 5,013
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.
Springer, 1 edition, Paperback, New

NT$ 3,648

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