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portada 3D Interconnect Architectures for Heterogeneous Technologies
Type
Physical Book
Publisher
Author
Year
2022
Pages
424
Format
Paperback
ISBN13
9783030982300

3D Interconnect Architectures for Heterogeneous Technologies

Bamberg,Jan Moritz Joseph, Joseph,Alberto Garcia-Ortiz, Garcia-Ortiz Lennart Bamberg (Author) · Springer Nature B.V. · Paperback

3D Interconnect Architectures for Heterogeneous Technologies - Bamberg,Jan Moritz Joseph, Joseph,Alberto Garcia-Ortiz, Garcia-Ortiz Lennart Bamberg

New Book Imported to Taiwan
Delivery: 07 Oct - 20 Oct Shipping: 11 to 15 business days.
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