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portada Advanced Flip Chip Packaging
Type
Physical Book
Publisher
Author
Year
2013
Language
English
Pages
560
Format
Hardcover
ISBN
9781441957672
ISBN13
9781441957672
Edition No.
2013
Categories

Advanced Flip Chip Packaging

Ho-Ming (Edt) Tong (Author) · Springer · Hardcover

Advanced Flip Chip Packaging - ho-ming (edt) tong

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Synopsis "Advanced Flip Chip Packaging "

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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The binding of this edition is Hardcover.

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