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portada advanced packaging for microelectronic and microsystem applications
advanced packaging for microelectronic and microsystem applicationsadvanced packaging for microelectronic and microsystem applicationsadvanced packaging for microelectronic and microsystem applications
Type
Physical Book
Publisher
Author
Pages
116
ISBN
3639096762
ISBN13
9783639096767
Categories

advanced packaging for microelectronic and microsystem applications

Travis Anderson (Author) · vdm verlag · Physical Book

advanced packaging for microelectronic and microsystem applications - travis anderson

New Book Imported to Taiwan
Delivery: 24 Sep - 02 Oct Shipping: 5 to 6 business days.
NT$ 1,937
NT$ 1,937

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Synopsis "advanced packaging for microelectronic and microsystem applications"

the emergence of gan-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility pow ...

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