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portada High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics. Emerging Capabilities and Research Objectives: Proceedings of a Workshop

High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics. Emerging Capabilities and Research Objectives: Proceedings of a Workshop

Defense Materials Manufacturing And Infrastructure Standing Committee;Linda Casola;National Materials And Manufacturing Board;Engineering, And Medicine National Academies Of Sciences;Division On Engineering And Physical Sciences (Author) · National Academies Press · Paperback

High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics. Emerging Capabilities and Research Objectives: Proceedings of a Workshop - Defense Materials Manufacturing and Infrastructure Standing Committee;Linda Casola;National Materials and Manufacturing Board;Engineering, and Medicine National Academies of Sciences;Division on Engineering and Physical Sciences

New Book Imported to Taiwan
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NT$ 2,363
NT$ 2,363

Synopsis "High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics. Emerging Capabilities and Research Objectives: Proceedings of a Workshop"

High-entropy materials, ultra-strong molecules, and nanoelectronics have become a focus of active research because of their unique potential and applications. Global research is rapidly accelerating and unlocking major recent breakthroughs. It is important to highlight these recent developments and explore possibilities for future research and applications. The National Academies convened a workshop on February 10-11, 2016 to discuss issues in defense materials, manufacturing, and infrastructure. Key topics of discussion included emerging capabilities and research objectives for ultra-strong molecules, high-entropy materials, and nanoelectronics. This publication summarizes the presentations and discussions from the workshop. Table of ContentsFront MatterOverview1 Ultra-Strong Molecules2 High-Entropy Materials3 NanoelectronicsReferencesAppendixesAppendix A: Workshop Statement of TaskAppendix B: Registered WorkshopParticipantsAppendix C: Workshop AgendaAppendix D: Acronyms

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