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portada High Performance Design Automation for Multi-Chip Modules and Packages
Type
Physical Book
Publisher
Author
Language
English
Pages
264
Format
Hardcover
ISBN13
9789810223076
Categories

High Performance Design Automation for Multi-Chip Modules and Packages

Cho, Jun Dong ; Franzon, Paul D. (Author) · World Scientific Publishing Company · Hardcover

High Performance Design Automation for Multi-Chip Modules and Packages - Cho, Jun Dong ; Franzon, Paul D.

New Book Imported to Taiwan
Delivery: 13 Oct - 28 Oct Shipping: 13 to 19 business days.
NT$ 4,332
NT$ 4,332

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Synopsis "High Performance Design Automation for Multi-Chip Modules and Packages"

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

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The binding of this edition is Hardcover.

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