你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada Introduction to Microelectronics Advanced Packaging Assurance
Type
Physical Book
Publisher
Author
Language
English
Format
Hardcover
ISBN13
9783031861017

Introduction to Microelectronics Advanced Packaging Assurance

Asadizanjani Navid,Reddy Kottur Himanandhan,Dalir Hamed (Author) · Springer · Hardcover

Introduction to Microelectronics Advanced Packaging Assurance - Asadizanjani Navid,Reddy Kottur Himanandhan,Dalir Hamed

Cheaper New Book Imported to Taiwan
Delivery: 08 Oct - 21 Oct Shipping: 12 to 16 business days.
NT$ 1,867
Faster New Book Imported to Taiwan
Delivery: 29 Sep - 07 Oct Shipping: 5 to 6 business days.
NT$ 2,391
NT$ 1,867

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "Introduction to Microelectronics Advanced Packaging Assurance"

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Hardcover.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews