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portada MEMS Packaging Technologies and 3D Integration
Type
Physical Book
Publisher
Author
Language
English
Pages
210
Format
Hardcover
Dimensions
24.4x17x1.8 cm
Weight
0.65 kg.
ISBN13
9783036542584
Categories

MEMS Packaging Technologies and 3D Integration

Seok, Seonho (Author) · Mdpi AG · Hardcover

MEMS Packaging Technologies and 3D Integration - Seok, Seonho

New Book Imported to Taiwan
Delivery: 20 Oct - 28 Oct Shipping: 5 to 6 business days.
NT$ 2,239
NT$ 2,239

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Synopsis "MEMS Packaging Technologies and 3D Integration"

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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The binding of this edition is Hardcover.

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