你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0
  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

Select your country

Americas

Europe

Rest of the world

portada multilayer ceramic substrate - technology for vlsi package/multichip module
multilayer ceramic substrate - technology for vlsi package/multichip modulemultilayer ceramic substrate - technology for vlsi package/multichip module
Type
Physical Book
Publisher
Author
Language
English
Pages
256
ISBN
185166579X
ISBN13
9781851665792

multilayer ceramic substrate - technology for vlsi package/multichip module

Otsuka (Author) · Springer · Physical Book

multilayer ceramic substrate - technology for vlsi package/multichip module - otsuka

Cheaper New Book Imported to Taiwan
Delivery: 18 Sep - 01 Oct Shipping: 12 to 16 business days.
NT$ 9,505
Faster New Book Imported to Taiwan
Delivery: 08 Sep - 16 Sep Shipping: 4 to 5 business days.
NT$ 12,587
NT$ 9,505

Synopsis "multilayer ceramic substrate - technology for vlsi package/multichip module"

this book is a translation of an important japanese work on electronic ceramics and includes much experimental data. it will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent japanese research in this rapidly developing field.

Customers reviews

Frequently Asked Questions about the Book

All books in our catalog are Original.
The book is written in English.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews