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portada Reliability Technology for Integrated Circuit Packaging
Type
Physical Book
Publisher
Author
Language
English
Pages
509
Format
Hardcover
ISBN13
9789819538843

Reliability Technology for Integrated Circuit Packaging

Zhou, Bin; En, Yunfei; Chen, Si (Author) · Springer · Hardcover

Reliability Technology for Integrated Circuit Packaging - Zhou, Bin; En, Yunfei; Chen, Si

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Synopsis "Reliability Technology for Integrated Circuit Packaging"

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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The book is written in English.

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The binding of this edition is Hardcover.

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