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portada RF and Microwave Microelectronics Packaging II
Type
Physical Book
Publisher
Language
English
Pages
172
Format
Hardcover
Dimensions
23.4 x 15.6 x 1.3 cm
Weight
0.44 kg.
ISBN13
9783319516967

RF and Microwave Microelectronics Packaging II

Kuang, Ken ; Sturdivant, Rick (Author) · Springer · Hardcover

RF and Microwave Microelectronics Packaging II - Kuang, Ken ; Sturdivant, Rick

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Synopsis "RF and Microwave Microelectronics Packaging II"

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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