你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Type
Physical Book
Author
Publisher
Language
English
Pages
280
Format
Paperback
Dimensions
23.4x15.6x1.7 cm
Weight
0.44 kg.
ISBN13
9781461359425
Categories

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

Nishath K. Verghese (Author) · Timothy J. Schmerbeck (Author) · David J. Allstot (Author) · Springer · Paperback

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits - Verghese, Nishath K. ; Schmerbeck, Timothy J. ; Allstot, David J.

Cheaper New Book Imported to Taiwan
Delivery: 15 Oct - 28 Oct Shipping: 12 to 16 business days.
NT$ 4,987
Faster New Book Imported to Taiwan
Delivery: 06 Oct - 14 Oct Shipping: 5 to 6 business days.
NT$ 6,531
NT$ 4,987

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits"

The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews