你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0

My Account

  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

menu

Select your country

Americas

Europe

Rest of the world

portada wafer bonding: applications and technology
Type
Physical Book
Illustrated by
Publisher
Author
Year
2004
Language
English
Pages
504
Format
Hardcover
Dimensions
23.4x15.5x3.3 cm
Weight
0.84 kg.
ISBN
3540210490
ISBN13
9783540210498
Categories

wafer bonding: applications and technology

Marin Alexe (Illustrated by) · Ulrich Gösele (Illustrated by) · Springer · Hardcover

wafer bonding: applications and technology - Alexe, Marin ; Gösele, Ulrich

Cheaper New Book Imported to Taiwan
Delivery: 03 Nov - 16 Nov Shipping: 15 to 19 business days.
NT$ 10,749
Faster New Book Imported to Taiwan
Delivery: 21 Oct - 29 Oct Shipping: 6 to 7 business days.
NT$ 13,819
NT$ 10,749

Choose the list to add your product or create one New List

Go to My Wishlists
Calculate shipping cost

Synopsis "wafer bonding: applications and technology"

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Customers reviews

More customer reviews
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)
  • 0% (0)

Frequently Asked Questions about the Book

Is the book original?

All books in our catalog are Original.

In what language is the book written?

The book is written in English.

What is the format of this book?

The binding of this edition is Hardcover.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews