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portada Advanced Flip Chip Packaging
Type
Physical Book
Publisher
Author
Language
English
Pages
560
Format
Paperback
ISBN13
9781489979339
Edition No.
1
Categories

Advanced Flip Chip Packaging

Tong, Ho-Ming ; Lai, Yi-Shao ; Wong, C. P. (Author) · Springer · Paperback

Advanced Flip Chip Packaging - Tong, Ho-Ming ; Lai, Yi-Shao ; Wong, C. P.

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Synopsis "Advanced Flip Chip Packaging"

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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The book is written in English.

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The binding of this edition is Paperback.

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