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portada Foldable Flex and Thinned Silicon Multichip Packaging Technology
Type
Physical Book
Publisher
Author
Language
English
Pages
347
Format
Paperback
Dimensions
23.4x15.6x2 cm
Weight
0.52 kg.
ISBN13
9781461349778
Categories

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Balde, John W. (Author) · Springer · Paperback

Foldable Flex and Thinned Silicon Multichip Packaging Technology - Balde, John W.

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Synopsis "Foldable Flex and Thinned Silicon Multichip Packaging Technology"

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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The book is written in English.

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