你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0
  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

Select your country

Americas

Europe

Rest of the world

portada Low-Dimensional Structures in Semiconductors: From Basic Physics to Applications
Type
Physical Book
Publisher
Language
English
Pages
226
Format
Paperback
Dimensions
25.4 x 17.8 x 1.3 cm
Weight
0.42 kg.
ISBN13
9781489906250

Low-Dimensional Structures in Semiconductors: From Basic Physics to Applications

Peaker, A. R. ; Grimmeiss, H. G. (Author) · Springer · Paperback

Low-Dimensional Structures in Semiconductors: From Basic Physics to Applications - Peaker, A. R. ; Grimmeiss, H. G.

Cheaper New Book Imported to Taiwan
Delivery: 18 Sep - 01 Oct Shipping: 12 to 16 business days.
NT$ 6,461
Faster New Book Imported to Taiwan
Delivery: 08 Sep - 16 Sep Shipping: 4 to 5 business days.
NT$ 9,111
NT$ 6,461

Synopsis "Low-Dimensional Structures in Semiconductors: From Basic Physics to Applications"

This volume contains a sequence of reviews presented at the NATO Advanced Study Institute on 'Low Dimensional Structures in Semiconductors ... from Basic Physics to Applications.' This was part of the International School of Materials Science and 1990 at the Ettore Majorana Centre in Sicily. Technology held in July Only a few years ago, Low Dimensional Structures was an esoteric concept, but now it is apparent they are likely to playa major role in the next generation of electronic devices. The theme of the School acknowledged this rapidly developing maturity.' The contributions to the volume consider not only the essential physics, but take a wider view of the topic, starting from material growth and processing, then prog- ressing right through to applications with some discussion of the likely use of low dimensional devices in systems. The papers are arranged into four sections, the first of which deals with basic con- cepts of semiconductor and low dimensional systems. The second section is on growth and fabrication, reviewing MBE and MOVPE methods and discussing the achievements and limitations of techniques to reduce structures into the realms of one and zero dimensions. The third section covers the crucial issue of interfaces while the final section deals with devices and device physics.

Customers reviews

Frequently Asked Questions about the Book

All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews