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portada Materials for Advanced Packaging
Type
Physical Book
Publisher
Author
Year
2016
Language
English
Pages
988
Format
Paperback
Dimensions
23.4x15.6 cm
ISBN13
9783319450995

Materials for Advanced Packaging

C.p. Wong;Daniel Lu (Author) · Springer Nature B.V. · Paperback

Materials for Advanced Packaging - C.P. Wong;Daniel Lu

New Book Imported to Taiwan
Delivery: 30 Sep - 13 Oct Shipping: 12 to 16 business days.
NT$ 1,977
NT$ 1,977

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Synopsis "Materials for Advanced Packaging"

This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

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The binding of this edition is Paperback.

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