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portada Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition
Type
Physical Book
Author
Publisher
Year
2013
Language
English
Pages
576
Format
Hardcover
Dimensions
24.1 x 18.5 x 3.3 cm
Weight
1.09 kg.
ISBN13
9780071821018
Edition No.
0006
Categories

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

Peter Van Zant (Author) · McGraw-Hill Companies · Hardcover

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition - Van Zant, Peter

New Book Imported to Taiwan
Delivery: 14 Sep - 24 Sep Shipping: 10 to 13 business days.
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NT$ 7,541

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Synopsis "Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition "

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.COVERAGE INCLUDES: The semiconductor industryProperties of semiconductor materials and chemicalsCrystal growth and silicon wafer preparationWafer fabrication and packagingContamination controlProductivity and process yieldsOxidationThe ten-step patterning process--surface preparation to exposure; developing to final inspectionNext generation lithographyDopingLayer depositionMetallizationProcess and device evaluationThe business of wafer fabricationDevices and integrated circuit formationIntegrated circuitsPackaging

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