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portada Self-Organized 3d Integrated Optical Interconnects
Type
Physical Book
Publisher
Author
Language
English
Format
Hardcover
ISBN13
9789814877046

Self-Organized 3d Integrated Optical Interconnects

Tetsuzo Yoshimura (Author) · Jenny Stanford Pub · Hardcover

Self-Organized 3d Integrated Optical Interconnects - Tetsuzo Yoshimura

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Synopsis "Self-Organized 3d Integrated Optical Interconnects "

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

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