你好! Shipping to Taiwan with premium packaging for just NT$300 

Ship to
Taiwan
0
  • argentina
  • chile
  • colombia
  • españa
  • méxico
  • perú
  • estados unidos
  • internacional

Select your country

Americas

Europe

Rest of the world

portada semiconductor device modeling with spice
Type
Physical Book
Year
1998
Language
English
Pages
496
Format
Paperback
Dimensions
23.3x15.6x2.5 cm
Weight
0.66 kg.
ISBN
0071349553
ISBN13
9780071349550
Edition No.
0003

semiconductor device modeling with spice

Giuseppe Massabrio (Author) · Paolo Antognetti (Author) · McGraw-Hill Companies · Paperback

semiconductor device modeling with spice - Massabrio, Giuseppe ; Antognetti, Paolo

Cheaper New Book Imported to Taiwan
Delivery: 19 Oct - 30 Oct Shipping: 12 to 16 business days.
NT$ 3,971
Faster New Book Imported to Taiwan
Delivery: 21 Oct - 29 Oct Shipping: 14 to 15 business days.
NT$ 4,367
NT$ 3,971

Synopsis "semiconductor device modeling with spice"

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

Customers reviews

Frequently Asked Questions about the Book

All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.

Questions and Answers about the Book

Do you have a question about the book? Login to be able to add your own question.

Opinions about Bookdelivery

More customer reviews