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portada Wireless Interface Technologies for 3d ic and Module Integration
Type
Physical Book
Publisher
Author
Year
2021
Language
English
Pages
300
Format
Hardcover
ISBN13
9781108841214
Edition No.
1
Categories

Wireless Interface Technologies for 3d ic and Module Integration

Tadahiro Kuroda; Wai-Yeung Yip (Author) · Cambridge University Press · Hardcover

Wireless Interface Technologies for 3d ic and Module Integration - Tadahiro Kuroda; Wai-Yeung Yip

New Book Imported to Taiwan
Delivery: 14 Sep - 22 Sep Shipping: 4 to 5 business days.
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NT$ 6,968

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Synopsis "Wireless Interface Technologies for 3d ic and Module Integration "

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

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